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3Northway Lane North Latham,New York 12110.
Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com
SPECIFICATION
PART NO. : MTB10000-UR-A 10 SEGMENT LIGHT BAR
MTB10000-UR-A
Dimensions
22.86 1.78 8.0
10 SEGMENT LIGHT BAR
0.25
5.08
10.16
7.62
2.54
25.27
MARK
0.5 3.5 MIN. 2.54X9=22.86
Notes:
1. The slope angle of any PIN may be 5.0 Max. 2. All dimensions are in mm, tolerance is 0.25mm unless otherwise noted.
Internal Circuit Diagram
MTB10000-UR-A
PIN. 1 2 3 4 5 6 7 8 9 10
A
B
C
D
E
F
G
H
I
J
PIN. 20
19
18
17
16
15
14
13
12
11
VER.: 01 Date: 2007/10/04
Page: 1/5
MTB10000-UR-A
10 SEGMENT LIGHT BAR
Description
LED Chip Part No.
Material Emitting Color
Face Color
Surface Segments
MTB10000-UR-A
AlGaAs/GaAs
Super Red
Grey
White
Absolute Maximum Ratings at Ta=25
Parameter
Power Dissipation Per Segment Pulse Current(1/10Duty Cycle,0.1ms Pulse Width.) Per Chip Forward Current Per Chip Reverse (Leakage)Current Per Chip Reverse Voltage Per Chip Operating Temperature Range Storage Temperature Range Soldering Temperature.
Symbol
PD IFP IF Ir VR Topr. Tstg. Tsol.
Rating
66 100 30 100 4 -25 to +85 -40 to +100 Dip Soldering: 260 Hand Soldering: 350
Unit
mW mA mA uA V
for 5 sec. for 3 sec.
VER.: 01 Date: 2007/10/04
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MTB10000-UR-A
Electrical and Optical Characteristics:
Parameter
Luminous Intensity Per Segment Forward Voltage Peak Wavelength Dominant Wavelength Reverse Current Per Chip (Leakage Current Per Chip) Spectrum Line Halfwidth Response Time
10 SEGMENT LIGHT BAR
Symbol
IV Vf p d Ir
Condition
If=10mA/seg. If=20mA/seg. If=20mA/seg. If=20mA/seg. Vr=4V If=20mA/seg. -----------
Min.
5.3
Typ.
12.5 1.8 660 643
Max.
Unit
mcd
2.2
V nm nm
100 20 250
A nm ns
T
Note: Customer's special requirements are also welcome.
VER.: 01 Date: 2007/10/04
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MTB10000-UR-A
Typical Electrical/Optical Characteristic Curves (25
1.0
10 SEGMENT LIGHT BAR
Ambient Temperature Unless Otherwise Noted)
Ratio of Maximum Operating Peak Current to Temperature Derated DC Current
100
OPERATION IN THIS REGION REOUIRES TEMPERATURE DERATING OF IDC MAXIMUM
Relative Intensity
0.5
10
IF PEAK IDC MAX
0 10
KH 10
HZ 1K
H 3K
0 30 HZ
HZ
Z
600
650
700
750
1
Z
1
Wavelength (nm)
100 10 1000 tp - Pulse Duration - s
10000
Fig.1 RELATIVE INTENSITY VS. WAVELENGTH
50
Forward Current IF(mA)
Fig.2 MAXIMUM TOLERABLE PEAK CURRENT VS. PULSE DURATION
50
Forward Current IF(mA)
40 30 20 10
40 30 20 10 0 20 40 60 80 100
1.4
1.6 1.8 2.0 2.2 Forward Voltage VF(V)
2..4
Fig .3 FORWARD CURRENT VS. FORWARD VOLTAGE PER CHIP
Ambient Temperature Ta (C) Fig.4 FORWARD CURRENT VS. DERATING CURVE
25
Relative Luminous Intensity Normalized at 10mA
20 15 10 5
Relative Luminous Intensity
2.0 1.0 0.5 0.2 0.1 -30 -20 -10 0 10 20 30 40 50 60 70
0
10
20
30
40
Forward Current (mA)
Fig.5 RELATIVE LUMINOUS INTENSITY VS. FORWARD CURRENT
Ambient Temperature Ta (C) Fig.6 LUMINOUS INTENSITY VS. AMBIENT TEMPERATURE
VER.: 01 Date: 2007/10/04
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MTB10000-UR-A
Precautions in Use:
10 SEGMENT LIGHT BAR
PLEASE PAY SPECIAL ATTNTION TO THE NEXT POINT TO INCORPORATE OPTO DEVICE TO HIGH RELIABILITY
1. Do not bend the lead. Bending leads could cause breakage of leads or the degradation of the chip. When bending is unavoidable, strictly follow the cautionary instruction below. (1)Bend the leads before soldering. (2)Bending a lead must be done by fixing a lead tightly and applying no stress on the resin part. (3) The lead bending point must be more than 1.6mm away from the edge or the resin part. (4)When a pin is tested for its endurance, bending degree should be
repeated no more than two times.
2. Setting a product by using tool such as a holder should be avoided. When necessary, no stress should be applied to the resin part and lead to consider dimension tolerance, thermal expansion, thermal contraction of holder, product and circuit board etc. 3. The hole pitch of a circuit board must fit into the lead pitch of products. 4. When soldering, care the followings: (1)Do not heat a product under any stress (i.e.: twist) to leads. (2)Do not heat ( for example, by soldering ) a product while out side force is applied the resin part. (3 The lead bending point must be more than 1.6mm away from the edge or the resin part. (4)Soldering with PC Board should be conducted with following conditions. (a) For dip soldering Pre-heating : 90 Max. for within 60 Sec. Soldering Max. : 260 5 (Solder Temp.) for within 5 Sec. (b) Soldering iron : 350
Max. Cleaning time : 30Sec. Max.
6. Minimum amount of soldering flux should be used. Soldering flux should be applied only to the pin portion. 7. The following may damage products or LED chips: Attachment or contact of residual flux solvent onto the product surface or to LED chips, or invasion of the same into the product.
VER.: 01 Date: 2007/10/04
Page: 5/5

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